We offer

Complete end-end System Engineering Solutions

MASTERPCB Offers complete end-end System engineering solutions to our customers covering the following.

Feasibility Analysis

Before initiating any project or product, MASTERPCB will analyse and understand the complete system requirement and does the feasibility study analysis and prepare a methodology to assess and evaluate whether the consolidation of the instances would be technically feasible and be economically feasible. The methodology leverages MASTERPCB experience in delivering such solutions to clients globally on such strategic engagements for advising our clients for such programs on consolidation. 

At Master PCB we will be transparent to our customers in every stage of the feasibility and provide the appropriate feedback about the Scope, Issues and the associated business risk with the product/project. This would enable our customers to understand the risk and corresponding mitigation plans to make the sustainable and profitable investment.

Product Obsolescence and Re- Engineering

Hardware components become obsolete every few years. This necessitates re-design using components currently available in the market. MasterPCB with its ecosystem partnerships with leading semiconductor companies is uniquely positioned to re-design with components which are not likely to become obsolete in the near feature. 

MasterPCB has been equipped with the necessary expertise, tools and systems to redesign or reverse engineer the complete product including electrical, mechanical & electronics functions in support of through-life and obsolescence management to keep your products and systems operating when original components are no longer available. Our services include complete redesign from scratch, sub-system or component redesign, re-creation of drawings and documents from existing product/items and manufacture based on old product or the limited documentation available to customer. 

MASTERPCB’s system engineering team support customers globally in the area of Electrical, Electronics, and Mechanical & Software to provide sustainable engineering support throughout the product cycle time. 

The team also provides engineering support for cost reduction, End of life, Re-engineering firmware support. Both the PCB engineers and System engineering teams work with world class EMS facilities worldwide from our ecosystems to provide best in class price-performance solutions. 

We also help organizations to re-architect their product/solution using current technologies, which results in efficient products/solutions with extended product life cycle. MasterPCB considers product/solution scalability and flexibility as key design objectives while re-engineering. We also help in extending the product/solution to new areas so as to address a larger market segment.

Requirements Engineering

It’s a process of ensuring the specified requirements meet the customer needs. It’s concerned with finding problems with the requirements. These problems can lead to extensive rework costs when these they are discovered in the later stages, or after the system is in service. The cost of fixing a requirements problem by making a system change is usually much greater than repairing design or code errors. Because a change to the requirements usually means the design and implementation must also be changed, and re-tested.

During the requirements validation process, different types of checks should be carried out on the requirements. These checks include:

Validity checks: The functions proposed by stakeholders should be aligned with what the system needs to perform. You may find later that there are additional or different functions are required instead.

Consistency checks: Requirements in the document shouldn’t conflict or different description of the same function

Completeness checks: The document should include all the requirements and constrains.

Realism checks: Ensure the requirements can actually be implemented using the knowledge of existing technology, the budget, schedule, etc.

Verifiability: Requirements should be written so that they can be tested. This means you should be able to write a set of tests that demonstrate that the system meets the specified requirements.

There are some techniques you can use to validate the requirements, and you may use one or more of them together, depending on your needs.

Requirements Reviews: A team of system customer; those who interact with the customer to gather requirements, and system developers start reading the requirements in the document, and investigate in a great detail to check for errors, inconsistency, conflicts, and any ambiguity. Then they may negotiate with the customer on how to solve the problems and errors found.

Prototyping: We’ve discussed the prototyping as one of the (non-standalone) software process methodology, which used as part of full methodologies, and we’ve also mentioned in can be used in the requirements engineering. In this approach to validation, an executable model of the system is demonstrated to the customer and end users to validate, and ensure if it meets their needs. Prototyping is usually used when the requirements aren’t clear. So, we make a quick design of the system to validate the requirements. If it fails, we then refine it, and check again, until it meets the customer needs. This definitely will decrease the cost as a result of having a clear, understandable, consistent requirement.

Test-case Generation: As we’ve just mentioned, the requirements need to be testable. If the tests for the requirements are added as part of the validation process, this often reveals requirements problems. If the test is difficult or impossible to design, this usually means that the requirements will be difficult to implement and should be reconsidered. 

System Architecture Planning

Every business exceeding a few people enables the efficient concurrent work of these people by dividing the tasks in smaller more specialized jobs, the decomposition principle in action. This decomposition of responsibilities requires an opposing force integrating the activities in a useful overall business result. Several integrating processes are active in parallel, such as project management, commercial management et cetera.

The System Architecting Process is responsible for:

  • The Integral Technical aspects of the Product Creation Process, from requirement to deployment.
  • The Integral Technical Vision and Synergy in the Policy and Planning Process. The System Architecting Process is striving for an optimal overall business result, by creating and maintaining the key issues, such as a balanced and consistent design, selection of the least complex solution, and satisfaction of the stakeholders. The System Architecture Process is balancing amongst others:
  • External and internal requirements
  • Short term needs and long term interests
  • Efforts and risks from requirements to verification
  • Mutual influence of detailed designs
  • Value and costs

System Design Optimization


  • Experienced in Board level & System level EMI Analysis.
  • Frequency V/S dB plot for Different standards (FCC, CISPR, VCCI or User specific)
  • RE/CE analysis to find out how much the product is emitting.
  • RI/CI analysis to find out how much the product can withstand external radiation.
  • 3D Magnetic/Electric & Current density Plots

Signal & Power Integrity, Thermal Analysis

Signal integrity:

  • Experience of handling pre layout & post layout designs/topologies helps customer to first time right designs.
  • Successfully executed complex Multi drop/Multipoint topologies.
  • Asserting PCB layer stack up/Layer ordering/PCB materials based on SI results.
  • Validating the logic level, Drive strengths, Termination techniques, Thresholds, Over/Under shoot, Propagation Delay, Noise margin etc., Slew  Rate, Timing Budget(setup/Hold time), EYE Diagram.
  • BER, ISI, Jitter, Loss (IL,RL) analysis.
  • Cross talk analysis and mitigation methodologies.
  • SerDes/DDRx/XAUI/PCIe interfaces.
  • Handled up to 12.5 Gb speed.

Power Integrity:

  • IR/DC Drop analysis with Voltage/Current Density 3D plots
  • Decoupling Analysis with Frequency V/S Impedance plot
  • Plane Noise Analysis with 3D plot of plane noise

Thermal Analysis:

  • Detailed reports indicating component and board temperature profiles
  • Heat sink and cooling proposals
  • Metal core and thermal ladder PCB designs
  • Mean time between failure study
  • Major heat transfer mechanisms analysis viz., Conduction, Convection, Radiation

Box Build & Radome Design

Box Build & Test:

We are vertically integrated and can take your product from concept to design through manufacturing, i.e. from prototype to full production. Master PCB also offers logistics services for consignment and/or turn-key builds with components and materials from trusted suppliers. When you add our state of the art analytical lab for product reliability and assurance, you get a true one stop/one solution electronic manufacturing services (EMS) provider that is capable of meeting all your product requirements.

  • PCB assembly services
  • Testing services
  • PCB coating and/or encapsulation
  • Manufacturing and testing
  • DFM/DFT analysis
  • Leaded or lead-free solder assembly
  • Touch screen integration

Radome Design:

MASTERPCB specializes in the design and manufacture of composite radomes and the production of radar transparent materials. We have designed, developed, manufactured and tested specialist radomes for a range of applications including ground based radar systems, civil and military fast jet aircraft, guided missiles, surface ships and submarines.

Our comprehensive manufacturing facilities are geared to produce a wide range of glass reinforced composite radomes and other structures. We design, manufacture and test both solid and sandwich construction radomes, ranging from single skin ‘Half-Wave’ to A, B and C type sandwich structures for air, land, and sea applications.